ADT 7100 Series
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ADT 7120 |7130
The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.
With different models to choose from, each optimized for a specific range of applications, the 7120 / 7130 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available.
The 7120 / 7130 Dicing System is an industry leading platform designed for a variety of applications such as:
|
Ceramic Substrates & Capacitors |
Glass |
|
Automotive Sensors |
PZT |
|
Glass on Silicon |
LED & LED on PCB Packages |
|
Package Singulation (BGA, QFN) |
Opto-electronic Components |
|
SAW Filters |
Sensors & MEMS |
|
LTCC |
IC Wafers |
7120 / 7130 Series Features & Options:
• Extra Large Area Dicing (7100 XLA)• Large Area• Tilting Spindle
• Dressing Station for diamonds exposure and clogging prevention
7120 / 7130 Series Advantages:
• 2” and 4” spindle dicing systems• A full range of automatic vision capabilities• Advanced hardware platform for high reliability and low maintenance• Heavy Duty, cast-iron base structure for superior precision and accuracy• Increased yield, throughput and process control• Unique multi-panel processing capabilities• Special blade wear forecast algorithm
• User-friendly software platform
ADT 7122
ADT 7122
2″, DC-brushless, 1.2 kW, front-mounted, air-bearing spindle (60 krpm Max.), with closed-loop turntable.
Optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm, such as:
• Opto-electronic Components
• PCB BGA Panels
• High-brightness LED Packages
• Silicon Wafers
• SAW Filters
• Glass/Silicon Sensors
• MEMS
• PZT
System Specifications:
Work piece size: up to 200mm x 200mm
Blade size: 2″-3″
Spindle: Air-bearing, DC-brushless, 60 krpm/1.2 kW
High power 2.4kW Spindle (optional)
Indexing Axis (y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 µm
Cumulative accuracy: 1.5 µm
Index accuracy: 1.0 µm
Feed Axis (x)
Air slide
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with stepper motor
Resolution: 0.2 µm
Accuracy: 2.0 µm
Repeatability: 1.0 µm
Stroke: 50 mm
Rotary encoder
Z Liner Encoder – Optional
Z Clearance up to 3″ – Optional
Rotary Axis (Ø)
Drive: closed-loop, direct drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera, Fire-wire technology, Hight bright LED illumination (vertical & oblique)
Continuous digital magnification from x55 to x210 or from x35 to x140 (optional).
Utilities
Electrical: 200-240 VAC, 50/60 Hz, single phase
Air: 260 L/min @ 5.5 bar
Spindle coolant: 1.1 L/min tap water
Cutting water: up to 3 L/min
Dimensions (WXDXH)
965 x 1300 x 1600 mm
Weight: 900 kg
ADT 7124
4″, DC-brushless, 2.5 kW, air-bearing spindle, (30 krpm Max.), with closed-loop turntable.
Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 200 mm x 200 mm, such as:
• Glass• DWDM Optical Filters
• Thick Ceramic Substrates
System Specifications:
Work piece size: up to 200 mm x 200 mm
Blade size: 4″-5′
Spindle: Air-bearing, DC-brushless, 30 krpm/2.5 kW
Indexing Axis (y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 µm
Cumulative accuracy: 1.5 µm
Index accuracy: 1.0 µm
Feed Axis (x)
Air slide
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with stepper motor
Resolution: 0.2 µm
Accuracy: 2.0 µm
Repeatability: 1.0 µm
Stroke: 50 mm
Rotary encoder
Z Liner Encoder – Optional
Z Clearance up to 3″ – Optional
Rotary Axis (Ø)
Drive: closed-loop, direct drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera, Fire-wire technology, High bright LED illumination (vertical & oblique)
Continuous digital magnification from x55 to x210 or from x35 to x140 (optional)
Utilities
Electrical: 200-240 VAC, 50/60 Hz, single phase
Air: 260 L/min @ 5.5 bar
Spindle coolant: 1.1 L/min tap water
Cutting water: up to 3 L/min
Dimensions (WXDXH)
965 x 1300 x 1600 mm
Weight: 900 kg
7132
Front mount 2″ air bearing spindle, up to 1.2KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2″-3″ hub and hubless blades. Covering up to 12″ round products, 12″ x 9″ square substrates with frame or 12″ x 12″ chuck without frame.
The system is equiped with close-loop turn table, optimized for large panels and multi panels such as:
• 12″ and 8″ Silicon wafers
• PCB, QFN and BGA Panels
• High-brightness LED Packages
• SAW Filters
System Specifications:
Large Area Configuration: up to 300mm x 300mm
Blade size: 2″-3″
Spindle: Air-bearing, DC-brushless, 60 krpm/2.4 kW
High power 2.4kW Spindle (optional)
Indexing Axis (y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 µm
Cumulative accuracy: 1.5 µm
Index accuracy: 1.0 µm
Feed Axis (x)
Air slide
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with stepper motor
Resolution: 0.2 µm
Accuracy: 2.0 µm
Repeatability: 1.0 µm
Stroke: 50 mm
Rotary encoder
Z Liner Encoder – Optional
Z Clearance up to 3″ – Optional
Rotary Axis (Ø)
Drive: closed-loop, direct drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera, Fire-wire technology, Hight bright LED illumination (vertical & oblique)
Continuous digital magnification from x55 to x210 or from x35 to x140 (optional).
Utilities
Electrical: 200-240 VAC, 50/60 Hz, single phase
Air: 260 L/min @ 5.5 bar
Spindle coolant: 1.1 L/min tap water
Cutting water: up to 3 L/min
Dimensions (WXDXH)
965 x 1300 x 1600 mm
Weight: 900 kg
7134
4″ high power air bearing spindle, up to 2.5KW at 30krpm. DC Brushless motor provides close-loop speed control. Coveriing up to 12″ round products, 12″ x 9″ square substrates with frame or 12″ x 12″ chuck without frame.
The system is equiped with close-loop turn table, optimized for multi-angle dicing suitable for variety of products such as:
• Ceramic substrates
• Alumina
• Hybrids
• Thick film devices and more
System Specifications:
Large Area Configuration: up to 300mm x 300mm
Blade size: 4″-5′
Spindle: Air-bearing, DC-brushless, 30 krpm/2.5 kW
Indexing Axis (y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 µm
Cumulative accuracy: 1.5 µm
Index accuracy: 1.0 µm
Feed Axis (x)
Air slide
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with stepper motor
Resolution: 0.2 µm
Accuracy: 2.0 µm
Repeatability: 1.0 µm
Stroke: 50 mm
Rotary encoder
Z Liner Encoder – Optional
Z Clearance up to 3″ – Optional
Rotary Axis (Ø)
Drive: closed-loop, direct drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera, Fire-wire technology, High bright LED illumination (vertical & oblique)
Continuous digital magnification from x55 to x210 or from x35 to x140 (optional)
Utilities
Electrical: 200-240 VAC, 50/60 Hz, single phase
Air: 260 L/min @ 5.5 bar
Spindle coolant: 1.1 L/min tap water
Cutting water: up to 3 L/min
Dimensions (WXDXH)
965 x 1300 x 1600 mm
Weight: 900 kg
71MD
The 71MD dicing saw system is designed for a demanding and tight application such as PZT.
The system is equipped with Height on parts measuring system and it can be provided with large Z clearance in order to support thick jig’s.
Z linear encoder is equipped with the 71MD machine for best cut depth accuracy. It can be supplied with spindle balancing system for minimizing the spindle vibration.
Typical applications for Ultra-Sound sensors.
Features & Benefits
• Low-vibration spindle supported by new and advanced vibration monitoring features• Height measurement capabilities including “height-on-part”• Z linear Encoder with error mapping to enhance cut depth accuracy• Integrated balancing software for better calibration and stability• PZT Wall Thickness Measurement
• For more details please contact your ADT local representative.
71TS
Many optoelectronic components utilize 8° angular surfaces to eliminate back-reflection at connection or termination points. For the benefit of manufacturers who rely on costly and time-consuming grinding techniques to produce these angled surfaces, ADT has come up with an alternative.
The Tilting Spindle capability of the 71TS Model is designed to allow perpendicular cutting of optoelectronic materials and can be quickly and easily adjusted to dicing at angles between 0° and 15°. Fine adjustment of the spindle angle, along with blades, dicing parameters, and other inclusive process options developed specifically for your component type, guarantee precise angular cuts and excellent surface finish. Customers have found that these cuts are of a quality sufficient to reduce, if not completely eliminate, the need for separate polishing operations.
Features & Benefits
• Quick changeover from perpendicular (0°) to any angle up to 15°• Permits angular dicing of: Planar Wave Guides• Si, Silica-on-Silicon• Polymers on Si• InP• GaAs Fiber Wave Guides• LiNbO3• Fused Silica• Dedicated programmable work stations for both angular settings• Field fine adjustment capability
• 0.1° angular repeatability
• 0.1° angular resolution
Spindle adjustment takes no more than a few minutes and requires no special setup or reprogramming when switching to a different cutting angle.
The shaded area in (A) represents the amount of material to be removed by grinding and polishing after a perpendicular cut. An angular cut is shown in (B).
The 8° angular cut is used to suppress back-reflection in many optoelectronic components.
An angular 8° cut accomplished with a tilting spindle system.
For more details please contact your ADT local representative.
7100 XLA
7100 XLA is available with 2″ spindle or 4″ spindle.
The system is capable to handle up to 18″ x 24″ size singulating large PCB substrates or hard and brittle glass and ceramic panels.
Features & Benefits
• Large dicing area up to 18” X 24”• Available on the 2” spindle and 4” spindle• Typical application: Glass panels, PCB, Ceramic, FR4 + Copper, QFN and more• Increase theta precision for high accuracy over long cut lengths• Easy access for maintenance• Customized chucks configurations• Adjustable rotating monitor + USB hub
