ADT 7200 Series
Previous
Next
ADT 7220 | 7230
Step into the Future of Dicing
With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications:
• Silicon
• Glass on Silicon
• MEMS
• GaAs wafers
• Package Singulation (BGA & QFN)
• LTCC
• PCB
• Hard Materials
The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.
7200 Series Advantages
• Unique Wx3 wafer handling system streamlines wafer flow for greater productivity
• Continuous digital magnification vision System provides optimal magnification for any eye-point
• Special algorithm predicts blade wear rates to reduce height measurement time and increase UPH
• Touch panel display supports a user-friendly graphical interface New User Interface(NUI）
• Atomized wafer cleaning technology for superior process results
• Dedicated dressing cassette enables automatic blade dressing
• Built-in Inspection tray allows for in-process quality assessment
• Unique multi-panel processing capabilities
• Small footprint
• Optional: Dressing Station for diamonds exposure and clogging prevention
2″, DC-brushless, 1.2 kW, front-mounted, air-bearing spindle (60 krpm Max.), with closed-loop turntable.
Optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm, such as:
- Opto-electronic Components
- PCB BGA Panels
- High-brightness LED Packages
- Silicon Wafers
- SAW Filters
- Glass/Silicon Sensors
- MEMS
- PZT
System Specifications:
Work piece size: up to 200mm x 200mm
Blade size: 2″-3″
Spindle: Air-bearing, DC-brushless, 60 krpm/1.2 kW
High power 2.4kW Spindle (optional)
Indexing Axis (y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 µm
Cumulative accuracy: 1.5 µm
Index accuracy: 1.0 µm
Feed Axis (x)
Air slide
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with stepper motor
Resolution: 0.2 µm
Accuracy: 2.0 µm
Repeatability: 1.0 µm
Stroke: 50 mm
Rotary encoder
Z Liner Encoder – Optional
Z Clearance up to 3″ – Optional
Rotary Axis (Ø)
Drive: closed-loop, direct drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera, Fire-wire technology, Hight bright LED illumination (vertical & oblique)
Continuous digital magnification from x55 to x210 or from x35 to x140 (optional).
Utilities
Electrical: 200-240 VAC, 50/60 Hz, single phase
Air: 260 L/min @ 5.5 bar
Spindle coolant: 1.1 L/min tap water
Cutting water: up to 3 L/min
Dimensions (WXDXH)
965 x 1300 x 1600 mm
Weight: 900 kg
2”, Air-bearing spindle, DC-brushless, rotate up to 60krpm.
Compatible with 2”- 3” hub and annular blades. Covering up to 8” round products.
Optimized for variety of products such as:
• Silicon wafers
• Thin-film devices
• High-brightness LED packages
• SAW filters
• Glass wafers, IR filters
• PZT transducers
System Specifications
Work piece size: Up to ∅ 200 mm or ∅ 300 mm
Blade size: 2″-3″
Spindle: Air bearing, DC-brushless 60 krpm, 2.4 kW
Indexing Axis (Y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.1 µm
Cumulative accuracy (∅200): 1.5 µm
Cumulative accuracy (∅300): 3 µm
Indexing accuracy: 1.0 µm
Feed Axis (x)
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with DC-brushless motor
Resolution: 0.2 µm
Repeatability: 1.0 µm
Rotary Axis (θ)
Drive: closed-loop, direct-drive, DC-brushless
Resolution: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera
High bright LED illumination (vertical & oblique)
Continuous digital magnification: from x 70 to x 280 or from 50 to x 200 (optional)
Cleaning Station
Full rinse and dry cycle
Spinning speed: 100-2,000 RPM
Cleaning method: Atomizing capabilities
Wafer Handling System
Slot to slot integrity and Inspection drawer
Options
BBD (Broken Blade Detector)
UV curing station
ESD (Electrostatic Discharge) kit
Barcode reader
Dress station
350° turn table rotation
SECS-GEM host communication (optional)
User Interface
Flat 17″ touch screen
New User Interface (NUI)
Multilanguage support
Keyboard & mouse
Utilities
Electrical: 200-240 VAC 50/60 Hz, Single phase
Air/N2: 700 L/min @ 5.5 bar
500 L/min compressed air, 200 L/min process air/ N2
Spindle coolant: 1.1 L/min
Cutting Water (DI/tap): Blade/process coolant – up to 7 L/min
Dimensions (WXDXH):
∅200: 965 x 1,460 x 1,700 mm
Weight ∅200: 1,200 kg
4″-5″ High-torque, DC-brushless, Air-bearing, 2.5 kW, 30 krpm spindle system, optimized for automated dicing of hard materials.
System Specifications:
Work piece size: ∅ 200
Blade size: 4″-5″
Spindle: Air bearing, DC-brushless, 30 krpm, 2.5 kW
Indexing Axis (Y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 µm
Cumulative accuracy (∅200): 1.5 µm
Indexing accuracy: 1.0 µm
Feed Axis (x)
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with DC-brushless motor
Resolution: 0.2 µm
Accuracy: 2.0 µm
Repeatability: 1.0 µm
Rotary Axis (T)
Drive: closed-loop, direct-drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera
High bright LED illumination (vertical & oblique)
Continuous digital magnification: from x170 to x280 or from x35 to x140 (optional)
Cleaning Station
Full rinse and dry cycle
Spinning speed: 100-2500 RPM
High pressure: up to 10 MPa
Atomizing cleaning capabilities
Wafer Handling System
Slot to slot integrity
Inspection drawer
BBD (Broken Blade Detector)
OPTIONS
ESD (Electrostatic Discharge) kit
UV curing station
Barcode reader
Dress station
SECS-GEM host communication
User Interface
Flat 17″ touch screen
New User Interface (NUI)
Multilanguage support
Keyboard & mouse
Utilities
Electrical: 200-240 VAC 50/60 Hz, Single phase
Air/N2: 700 L/min @ 5.5 bar
500 L/min compressed air, 200 L/min process air/ N2
Spindle coolant: 1.1 L/min tap water
Process Water (DI): Blade/process coolant – up to 7 L/min
High pressure cleaning – up to 5 L/min
Atomized cleaning: up to 0.15 L/min
High pressure cleaning: up to 5 L/min (optional)
Dimensions (WxDxH):
∅200: 965 x 1460 x 1700 mm
Weight ∅200: 1200 kg
2”, Air-bearing spindle, DC-brushless, rotate up to 60krpm.
Compatible with 2”- 3” hub and annular blades. Covering up to 300mm round wafer and/or 253mm X 243mm square products.
Optimized for variety of products such as:
- Silicon wafers
- Thin-film devices
- High-brightness LED packages
- QFN and BGA Packages
- Glass wafers, IR filters
- PZT transducers
System Specifications
Work piece size: Up to ∅ 300 mm or 253mm X 243mm square products
Blade size: 2″-3″
Spindle: Air bearing, DC-brushless 60 krpm, 1.2 kW
Indexing Axis (Y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.1 µm
Cumulative accuracy (∅300): 3 µm
Indexing accuracy: 1.0 µm
Feed Axis (x)
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with DC-brushless motor
Resolution: 0.2 µm
Repeatability: 1.0 µm
Rotary Axis (θ)
Drive: closed-loop, direct-drive, DC-brushless
Resolution: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera
High bright LED illumination (vertical & oblique)
Continuous digital magnification: from x 70 to x 280 or from 50 to x 200 (optional)
Cleaning Station
Full rinse and dry cycle
Spinning speed: 100-2,000 RPM
Cleaning method: Atomizing capabilities
Wafer Handling System
Slot to slot integrity and Inspection drawer
Options
BBD (Broken Blade Detector)
UV curing station
ESD (Electrostatic Discharge) kit
Barcode reader
Dress station
360° turn table rotation
SECS-GEM host communication
User Interface
Flat 17″ touch screen
New User Interface (NUI)
Multilanguage support
Keyboard & mouse
Utilities
Electrical: 200-240 VAC 50/60 Hz, Single phase
Air/N2: 700 L/min @ 5.5 bar
(500 L/min compressed air, 200 L/min process air/ N2)
Spindle coolant: 1.1 L/min
Cutting Water (DI/tap): Blade/process coolant – up to 7 L/min
Dimensions (WXDXH):
1,100 x 1,785 x 1,700 mm
Weight: 1,350 kg
4”, Air-bearing spindle, DC-brushless, rotate up to 30krpm.
Compatible with 4”- 5” blades. Covering up to 300mm round wafer and/or 253mm X 243mm square products.
Optimized for variety of products such as:
- Thick Glass wafers
- Thin-film devices
- Ceramic and Alumina
- PCB
- QFN and BGA Packages
System Specifications
Work piece size: Up to ∅ 300 mm or 253mm X 243mm square products
Blade size: 4″-5″
Spindle: Air bearing, DC-brushless 30 krpm, 2.5 kW
Indexing Axis (Y)
Drive: Ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.1 µm
Cumulative accuracy (∅300): 3 µm
Indexing accuracy: 1.0 µm
Feed Axis (x)
Drive: Ball bearing lead screw with DC-brushless motor
Feed rate: up to 600 mm/sec
Cut Depth Axis (z)
Drive: Ball bearing lead screw with DC-brushless motor
Resolution: 0.2 µm
Repeatability: 1.0 µm
Rotary Axis (θ)
Drive: closed-loop, direct-drive, DC-brushless
Resolution: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera
High bright LED illumination (vertical & oblique)
Continuous digital magnification: from x 70 to x 280 or from 50 to x 200 (optional)
Cleaning Station
Full rinse and dry cycle
Spinning speed: 100-2,000 RPM
Cleaning method: Atomizing capabilities
Wafer Handling System
Slot-to-slot integrity and Inspection drawer
Options
BBD (Broken Blade Detector)
UV curing station
ESD (Electrostatic Discharge) kit
Barcode reader
Dress station
360° turn table rotation
SECS-GEM host communication
User Interface
Flat 17″ touch screen
New User Interface (NUI)
Multilanguage support
Keyboard & mouse
Utilities
Electrical: 200-240 VAC 50/60 Hz, Single phase
Air/N2: 700 L/min @ 5.5 bar
(500 L/min compressed air, 200 L/min process air/ N2)
Spindle coolant: 1.1 L/min
Cutting Water (DI/tap): Blade/process coolant – up to 7 L/min
Dimensions (WXDXH):
1,100 x 1,785 x 1,700 mm
Weight: 1,350 kg
