RESIN-BOND DICING BLADE

• Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as QFN/MLF, Thick Ceramic Substrates, HTCC, and Glass
• Resin Blade thickness varies from 3 mils to 100 mils (depending on diamond grit size)
• Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)

Specification: