Zestron FA+

Your Benefits ZESTRON® FA+

Solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics (power modules, leadframe-based discrete, power LEDs), and packages (Flip Chips/CMOS). The cleaner is suitable for use in dip tanks (Ultrasonic and Spray-under-immersion) and centrifugal cleaning machines.

• High cleaning performance and very long bath life
  The product is characterized by its high cleaning performance and bath loading capability ensuring an extremely long bath life.
• No specific explosion-proof environment
  The cleaning medium does not require any specific explosion-proof environment.
• Good rinsability
  Due to the surfactant-free formulation, the product can be easily rinsed.
• Optimal preparation for subsequent processes
  For Flip Chips/CMOS, the cleaning agent reduces the void rate during underfill and improves the image resolution by removing all tacky fluxes. It creates optimal surface properties for subsequent wire bonding/molding processes, especially for power modules, leadframe-based discrete components, and Power LEDs.
• Cleaning agent regeneration
  During the use of ZESTRON® FA+, the ZESTRON® adsorber HM1 can remove heavy metals from the cleaning bath.