ASR Technologies Philippines, OPC
7920 7930 7234 ADT 7920 Cope with your Production Challenges 7920 As part of the growing market of the LED segment and the ongoing demand to lower the cost of production per unit (CoO), ADT has responded with a dual spindle system model 7900 Duo that doubles productivity while maintaining […]
7220 7230 7222 7223 7224 7232 7234 Previous Next ADT 7220 | 7230 7220/7230 Step into the Future of Dicing With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a […]
7100 7120-7130 7122 7124 7132 7134 71MD 71TS 7100 XLA Previous Next ADT 7120 |7130 ADT 7120 | 7130 The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility. With different models to choose from, each optimized for a specific range of applications, […]
Fully Automatic Twin Dicing System The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation. Features and Benefits […]
The ADT 8230 is a high-efficiency, high-precision, high-performance and low-cost fully automatic twin-spindle dicing machine with up to 12 inches maximum workpiece size. Features and Benefits Leading Applications Ease of Use The 8230 operates with the ADT intuitive New graphic User Interface (GUI), and the monitor screen is […]
8030 SERIESFULLY AUTOMATIC 12”TWIN DICING SYSTEM CONFIGURATION: Blade O.D.: 2”-3”Size: Ø12”, 12” X 12” FEATURE & BENEFITS: • Bridge type frame• Flexibility – Supports Hub and Hubless blades up to 3” O.D.• Dual microscopes, fixed non-contact sensors, and two dress stations• Spindles of 1.8 kW or 2.2 kW high power(for […]
With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as:• BGA• Soft Alumina• TiC• LTCC• Ferrite Blade thickness varies from 3 mils to 60 mils (depending on diamond grit size)Diamond grit size ranges from 2 microns to 70 […]
Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as QFN/MLF, Thick Ceramic Substrates, HTCC, and Glass
Resin Blade thickness varies from 3 mils to 100 mils (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)
ADT, a worldwide leader in dicing solutions, is pleased to add a full line of Hub Blades to its wide range of products.
ADT’s range of Hub Blades is a perfect solution for the optimization of the dicing process for various types of materials such as Silicon, GaAs, and other wafers.
ADT’s Annular Nickel Blades are produced using a state-of-the-art, tightly controlled electroforming process that guarantees a uniform distribution of diamonds throughout the Nickel layer. This process not only allows for blades to be produced to very tight tolerances but also permits optimization of grit size, hardness, and geometry to meet the particular requirements of your application.
